Sensor heat sink with ceramic
- 0.5 CNY/t. - from 99999 t.
- Courier
- In detail
- BrandSlitong
- Country of manufactureChina
- Length1-250MM "
- Width1-250MM "
- Colorgreen
- GTINceramic
- Board typeTwo-sided
- СonstructionFlexible
- Working temperature-55~350 °C
- Thickness0.1-8MM "
The processing technology of MEMS sensor needs to use MEMS technology, which is based on the mature microelectronics technology, integrated circuit technology and its processing technology. It has many similarities with traditional IC processes, such as photolithography, thin film deposition, doping, etching, chemical mechanical polishing, etc. , but some complex microstructures are difficult to be realized by IC processes, and must be manufactured by micromachining technology. Micromachining technology includes silicon bulk micromachining technology, surface micromachining technology and special micromachining technology. Volume processing technology refers to the process of etching the silicon substrate along the thickness direction of the silicon substrate, including wet etching and dry etching. It is an important method to achieve three - dimensional structure. Surface micromachining is to use thin film deposition, photolithography and etching technology. The movable structure is realized by depositing structural layer film on the sacrificial layer film, and then removing the sacrificial layer to release the structural layer.
Substrate type:96% Al2O3
Substrate material thickness:0.5mm
Conducting layer:Cu/Ni/Pd/Au
Thickness of metal layer:70μm
Surface preparation:ENEPIG
Metal single - sided / double sided:double sided
Copper plated through hole:yes
Solder mask:yes